**Job Description**
The postdoctoral activity focuses on understanding structure-adhesion relationships within the interfacial region of ultrathin material assemblies used in electronics, specifically printed circuit boards. This involves developing thin coating deposition techniques and identifying their physico-chemical structure using cutting-edge characterization methods. The research aims to develop and test new interfacial functionalities based on gathered knowledge, in collaboration with Circuit Foil Luxembourg to develop advanced materials for electronics.
**Skills & Abilities**
• Strong experimental background in surface treatment, surface characterisation, interface engineering or materials assembly, demonstrated by first author-publications in Q1 journals
• Knowledge and know-how on the physico-chemical aspects of material adhesion, interface engineering in multi-materials assemblies, or on the surface treatment of materials (asset)
• Ability to quickly adapt to issues by proposing new solutions, open to other researchers’ ideas
• Team player spirit, and ability to work in a timely fashion to meet deadlines
• Fluency in English, both oral and written (mandatory)
• Fluency in French, both oral and written (important asset)
• Other relevant languages (German, Luxembourgish) (plus)
**Qualifications**
Required Degree(s) in:
• Material Science and Engineering
• Material Chemistry
**Experience**
Other:
• Strong experimental background in surface treatment, surface characterisation, interface engineering or materials assembly, as demonstrated by first author-publications in Q1 journals
• PhD diploma must be recognized in Luxembourg
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